Potting glue is used on all kinds of control modules to do integral and general encapsulation of components to meet the basic requirements of moisture-proof, anti-fouling, and anti-corrosion. In addition, the use of silicone encapsulants can reduce stress and withstand high and low temperature impacts. For high-power control modules, thermal conductivity potting glue can be used to achieve the function of heat dissipation.

In order to ensure the stability and durability of the performance of power supply equipment in major industry applications, and eliminate the reduction in equipment reliability caused by environmental factors (moisture, salt spray, dust, vibration, heat, etc.), the power supply The industry has put forward more stringent requirements. Due to the unique properties of silicone materials, such as moisture resistance, hydrophobicity, electrical insulation, high and low temperature resistance, chemical stability, etc., they have been widely developed and applied in the power supply industry in recent years. They are typically technology-intensive and high-value-added. product.

The following points need to be considered when choosing electronic potting glue:

2. Resistance to cold and heat changes. Among the many types of electronic encapsulants, silicone electronic encapsulants have outstanding resistance to cold and heat, followed by polyurethane electronic encapsulants, then epoxy resin electronic encapsulants, and silicone encapsulants have the best performance .
4. Electrical and insulation properties. Among the common types of electronic potting glue, silicone electronic potting glue has better electrical insulation performance, followed by polyurethane electronic potting glue, and then epoxy resin electronic potting glue.
6. Flame retardancy. Many electrical appliances have flame-retardant requirements for electronic potting compounds, so that the electrical appliances will be safer in use.