Organic silicone adhesives can be divided into two categories: silicone resin as the main component and silicone rubber as the main component. Because silicone resins, especially phenyl silicone resins, have particularly good heat resistance, they can be used as the main component of high-temperature adhesives. Pure silicone resin-based organic silicone adhesive to silicone resin as the base material, adding some inorganic fillers and organic solvents mixed and become, used for bonding metal, glass fiber reinforced plastic and so on. Heat and pressure are required for curing.
Taking KH-505 high temperature adhesive as an example, it is formulated with polymethylphenyl silicone resin as the base material (the value of methyl/phenyl is 1.0), adding titanium oxide, zinc oxide, asbestos and mica powder and other inorganic fillers. Among them, asbestos can prevent the adhesive layer from cracking due to shrinkage; mica can increase the wettability of the adhesive layer on the sticky material; titanium oxide can increase the strength and improve the antioxidant property; zinc oxide can neutralize the trace acidity to prevent the corrosive effect on the sticky material. Curing conditions: 270 ℃ / 3h, pressure 5MPa: remove the pressure and then cured 425 ℃ / 3h, the bond strength has been greatly improved.KH-505 silicone adhesive's most outstanding performance is high temperature resistance, it can be used for a long time at 400 ℃ without being destroyed. It can be used for high temperature non-structural parts such as metal, ceramic bonding and sealing, screw fixing and mica laminate bonding. The disadvantage is that it has low strength and small toughness and cannot be used as a structural adhesive.
Organic silicone adhesive based on modified silicone resin is usually epoxy, polyester, phenolic and other organic resins to modified silicone resin. This type of adhesive can use the organic resin curing agent for curing, thus reducing the curing temperature, and maintain a high bond strength. Epoxy resins are one of the best known organic resins for bonding. This is due to the presence of polar hydroxyl and ether bonds inherent in the molecular chain of epoxy resins, making them highly adhesive to a variety of substances. Moreover, epoxy resins have low shrinkage during curing and produce low internal stress, which also contributes to the adhesion strength. The high-temperature adhesive made from epoxy-modified silicone resin as the main component was measured to have a maximum room-temperature shear strength of 93MPa after a 10h heat-resistance test at 200°C (Aluminum-Aluminum bonding, lap area of about 2cm²). Epoxy-modified silicone resin adhesive in use, due to the presence of a larger number of epoxy groups, it is necessary to add an appropriate amount of curing agent, such as maleic anhydride, etc., in order to reduce the curing temperature, to improve the degree of cross-linking of the resin and heat resistance, and to maintain a high bonding strength.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150A. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.