Organic silicone adhesives based on modified silicone resins are usually silicone resins modified with organic resins such as epoxy, polyester, and phenolic. These adhesives can be cured using the curing agent of the organic resin, thereby reducing the curing temperature and maintaining high bond strength. Epoxy resins are one of the best known organic resins for bonding. This is due to the presence of polar hydroxyl and ether bonds inherent in the molecular chain of epoxy resins, making them highly adhesive to a variety of substances. Moreover, epoxy resins have low shrinkage during curing and produce low internal stress, which also contributes to the adhesion strength. The high-temperature adhesive made from epoxy-modified silicone resin as the main component was measured to have a maximum room-temperature shear strength of 93MPa after a 10h heat-resistance test at 200°C (Aluminum-Aluminum bonding, lap area of about 2cm²). Epoxy-modified silicone resin adhesive in use, due to the presence of a larger number of epoxy groups, it is necessary to add an appropriate amount of curing agent, such as maleic anhydride, etc., in order to reduce the curing temperature, to improve the degree of cross-linking of the resin and heat resistance, and to maintain a high bonding strength.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150A. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.