Photoresist component: Polysilazane has good chemical stability and adaptability to photolithography processes, making it a component of photoresist that can accurately replicate tiny circuit patterns, helping to improve the resolution and accuracy of photolithography and meet the demand for smaller circuit manufacturing in semiconductor manufacturing.
Preparation of insulation layer: Polysilazane has excellent insulation properties and can form a uniform and dense insulation film on the surface of the chip, which is used to isolate different electrodes or circuit components, effectively isolate the influence of external environment on the internal circuit of the chip, prevent current leakage and short circuit, ensure accurate transmission and control of electrical signals in the chip, and improve the reliability and performance of the chip.
Passivation layer formation: It can form a passivation layer on the surface of semiconductor devices, protecting the circuits and components inside the chip from external environmental factors such as moisture, oxygen, impurities, etc., improving the stability and service life of the chip, while also reducing surface density of states, lowering interface traps, and improving the performance of semiconductor devices.
Electronic component packaging: Polysilazane can be used for packaging electronic components, providing excellent electrical performance and thermal stability, isolating chips and other electronic components from the external environment, providing protection and fixation, ensuring stable operation of electronic components in different working environments, and improving the overall reliability of semiconductor devices.
Low dielectric constant materials: With the development of semiconductor technology towards higher integration and faster speeds, low dielectric constant materials are needed to reduce signal transmission delay and lower power consumption. Polysilazane can be obtained by adjusting its molecular structure and preparation process to obtain materials with suitable low dielectric constants, which can be used to prepare insulating layers or interlayer dielectrics in semiconductor devices, meeting the requirements of high-speed and high-frequency integrated circuits.
Micro nano structure preparation: By utilizing the processability and thermal stability of polysilazane, various micro nano structures such as microchannels, microcavities, nanowires, etc. can be prepared through photolithography, etching, pyrolysis and other processes, which are used in semiconductor devices such as microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) to achieve functions such as sensors, actuators, filters, etc.
Mask material: In certain semiconductor manufacturing processes, polysilazane can be used as a mask material. It can form a protective coating in specific areas, blocking the influence of etchants or other process media on areas that do not require treatment, ensuring that the process is only carried out in the required areas, and improving the accuracy and controllability of the process.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.