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New organic boron-containing polysilazane materials break through high-temperature application bottlenecks, driving upgrades in the aerospace and electronics industries

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Recently, China's scientific research team has made significant progress in the field of high-performance ceramic precursor materials. Boron-modified Polysilazane (B-PSZ) has garnered widespread industry attention due to its unique high-temperature resistance, ceramizable properties, and multifunctional characteristics, making it a key material for high-end industries such as aerospace and electronic packaging.
Breakthrough Performance: Ultra-High Temperature Resistance and High Strength
Traditional polymers are prone to decomposition at high temperatures, whereas B-PSZ can transform into Si-B-C-N ceramics in environments ranging from 1000°C to 1800°C, forming a dense oxidation-resistant layer that effectively withstands extreme thermal shocks. Studies have shown that the introduction of boron elements significantly enhances the material's amorphous stability, presenting substantial potential in applications such as thermal barrier coatings for aircraft engines and protective layers for hypersonic vehicles.
Flexible Processing, Adaptable to Advanced Manufacturing Technologies
This material also boasts excellent processability, being soluble in common solvents and suitable for spray coating, impregnation, and even 3D printing. By adjusting boron content and molecular structure, researchers have achieved low-temperature crosslinking curing (150–300°C), substantially lowering the barriers to high-performance ceramic preparation and offering new solutions for the precision manufacturing of complex components.
Broad Application Prospects, Driving Industrial Upgrades
Currently, B-PSZ has begun to emerge in various fields:

Aerospace: Used in the preparation of carbon fiber-reinforced ceramic matrix composites (CMC) to enhance the thermal protection capabilities of aircraft.

Electronic Packaging: Its low dielectric constant properties make it suitable for 5G high-frequency device packaging, improving signal transmission efficiency.

Energy and Nuclear Industries: Its radiation resistance makes it a candidate material for nuclear reactor protective coatings.
Future Outlook: Cost Reduction and Application Expansion
Despite its remarkable performance, the high preparation cost of B-PSZ and the stringent oxygen-free process conditions remain challenges. Industry experts point out that future efforts should focus on developing more economical boron sources and optimizing curing technologies to promote its large-scale application in emerging fields such as new energy vehicle battery protection and flexible electronics.
With the rapid development of China's high-end manufacturing industry, B-PSZ is expected to become a core choice for next-generation ultra-high-temperature materials, providing crucial support for the national strategy of building a technological powerhouse.

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