In April 2025, with the market size of special silicon dioxide exceeding 16 billion yuan, innovative applications of silicon oxide materials in new energy, semiconductors, biomedicine and other fields are accelerating, becoming a key force in promoting the upgrading of high-end manufacturing industry.

In the semiconductor field, breakthrough progress has been made in silicon oxide thin film technology. The "ultra-low defect silicon oxide film" developed by a certain enterprise has been applied in advanced process chip manufacturing, achieving 2-nanometer thickness control through atomic layer deposition (ALD) technology, effectively improving transistor performance and reliability. This technology not only breaks through the accuracy bottleneck of traditional etching processes, but also provides key support for the mass production of 3D stacked chips.

The new energy industry is also undergoing changes. The first ton level mesoporous silica production line in China has been put into operation in Changzhou. Its developed spray insulation coating achieves the same effect as traditional 30mm insulation materials with a thickness of 4mm, with an energy-saving rate of 30% -50%. This material has been validated in industries such as petrochemicals and long-distance heating networks, helping enterprises reduce energy consumption costs. According to calculations, if 10% of steam equipment in the country adopts this technology, the annual energy savings can be equivalent to reducing carbon emissions by millions of tons.

In the field of biomedicine, nano silica exhibits the potential for a "drug carrier revolution". The mesoporous silica nanoparticles developed by a certain research team achieve precise delivery of anticancer drugs through surface functionalization modification. Clinical trials have shown that their bioavailability is increased by 4 times and side effects are reduced by 60%. This technology has entered the pilot stage and is expected to be industrialized within three years.

Industry experts point out that the breakthrough in the performance of silicon oxide materials comes from the innovation of preparation processes. The optimization of sol gel method, chemical vapor deposition and other technologies has improved the material purity to 99.999%, and the particle size uniformity has reached the nanometer level control. With the deepening trend of high performance and multifunctionality, silicon oxide materials will play a key role in more "bottleneck" fields, helping Chinese manufacturing move towards the high-end of the global value chain.