Chemical bond breaking and reconstruction
Changes under thermal action: In high-temperature environments, chemical bonds within silazane molecules (such as silicon nitrogen bonds, silicon silicon bonds, etc.) absorb heat, allowing the bonds to be overcome and leading to breakage. For example, as the temperature increases, the vibration of the silicon nitrogen bond in silazane intensifies. When a certain energy threshold is reached, the bond will break and form active intermediates such as free radicals. These intermediates may undergo reconstruction reactions, recombine to form new chemical bonds or release small molecule compounds, such as producing hydrogen, ammonia, and silicon containing small molecules, which can damage the original molecular structure of silazane, reduce the density of the insulation layer, and thus affect its stability and insulation performance.
Radiation induced situations: When subjected to ionizing radiation (such as gamma rays, high-energy electron beams, etc.) or ultraviolet radiation, the radiation energy is absorbed by silicon nitride molecules, causing electrons to undergo transitions and chemical bonds to enter excited states, thereby triggering the breaking of chemical bonds. Taking ultraviolet irradiation as an example, photon energy is sufficient to break some chemical bonds in silazane molecules, generating free radicals. These free radicals will subsequently trigger a series of chain reactions, including cross-linking and degradation of molecular chains, changing the original structural form of silazane molecules, making the microstructure of the insulation layer disordered and unstable.
Molecular Chain Movement and Aggregation State Changes
Molecular chain motion under temperature influence: As the temperature increases, the thermal motion of silazane molecular chains intensifies, and the spacing between molecular chains changes. At low temperatures, the movement of molecular chains is restricted and they are in a relatively stable aggregated state; As the temperature rises to a certain level, the molecular chains begin to have enough energy to move relatively freely, disrupting the originally regular arrangement structure and making the internal structure of the insulation layer loose. This will affect its ability to block conductive particles and lead to a decrease in insulation performance. For example, in the medium temperature range, slight changes in the movement of silicon nitride molecular chains may cause fluctuations in the dielectric constant and other performance parameters of the insulation layer, affecting its stability. As the temperature further increases, the molecular chain movement becomes more intense, and the stability is also more affected.
Changes under solvent action: When the silazane insulation layer comes into contact with organic solvents, organic solvent molecules may penetrate between the silazane molecular chains, causing a swelling effect and increasing the intermolecular distance, disrupting the originally tightly aggregated structure. This is similar to the swelling behavior of polymer materials in solvents, where the interaction force between silicon nitride molecular chains is weakened, and the physical stability and mechanical properties of the insulation layer are affected, making it prone to deformation, damage, and other situations, thereby reducing its stability as an insulation layer.
Adsorption and Reaction of Chemical Substances
Adsorption and hydrolysis reaction of water molecules: Under humid conditions, water molecules will adsorb on the surface of the silicon nitride insulating layer, and with their smaller molecular size, they may enter the interior of the silicon nitride molecules through diffusion and other means. The silicon nitrogen and silicon oxygen bonds in silazane are prone to undergo hydrolysis reactions with water molecules, resulting in the formation of corresponding hydroxyl compounds. For example, the hydrolysis of silicon nitrogen bonds in silazane will form silicon hydroxyl groups and ammonia. This process continues and destroys the molecular chain structure of silazane, causing it to become loose and porous from its originally continuous and dense state, seriously affecting the insulation performance and overall stability of the insulation layer.
Chemical reaction of acidic or alkaline substances: When acidic or alkaline substances come into contact with silazane, they will undergo a chemical reaction with silazane molecules based on the chemical properties of acidity and alkalinity. Acidic substances may provide hydrogen ions to attack some active sites in silazane molecules, leading to chemical bond breakage; Alkaline substances can easily promote hydrolysis reactions and accelerate the destruction of the structure of silazane molecules. For example, in alkaline environments, the hydrolysis rate of silazane is significantly accelerated, causing rapid degradation of molecular chains and changing their microscopic chemical composition and structure, thereby causing the insulation layer to lose its expected stability.
Charge transfer and electrical breakdown
Electron behavior under high electric field: When the silicon nitride insulating layer is in a high electric field strength environment, the originally bound electrons inside the insulating layer will gain energy under the action of electric field force. As the electric field strength continues to increase, the energy obtained by electrons is sufficient to overcome the binding energy, break free from the constraints of atoms or molecules, and become free electrons. These free electrons accelerate under the action of the electric field, collide with other atoms or molecules, and may excite more free electrons, forming an electron avalanche effect, ultimately leading to the formation of conductive channels inside the insulation layer, that is, the phenomenon of electrical breakdown. From a microscopic perspective, this is the migration behavior of electrons that changes the original insulation state of the insulation layer, making its microstructure no longer able to prevent the passage of current, seriously damaging the stability of the insulation layer.
Microscopic damage under mechanical stress
Stress induced molecular chain fracture and deformation: When the silicon nitride insulation layer is subjected to mechanical stresses such as tension, compression, and bending, the molecular chains will bear corresponding tensile or compressive forces at the microscopic level. If the stress exceeds the range that the binding force between molecular chains and the chemical bond energy can withstand, it will lead to the breakage or irreversible deformation of the molecular chain. For example, in the case of frequent bending, the silicon nitride molecular chain is constantly stretched and compressed at the bending point, and local chemical bonds will gradually break, causing the molecular chain to become shorter and the structure to be destroyed. Microscopic cracks and other defects will appear inside the insulation layer, which will continue to expand and ultimately affect the integrity and stability of the entire insulation layer, making it unable to effectively perform its insulation function.
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