As an insulating material
Interlayer insulation: In semiconductor chip manufacturing, inorganic polysilazane can be used to form interlayer insulation layers, isolating different circuit layers to prevent current leakage and signal interference, ensuring electrical independence between layers, and improving chip performance and reliability.
Gate insulation: As a gate insulation material, it can effectively control the conduction and cutoff of current in semiconductor devices. In devices such as metal oxide semiconductor field-effect transistors (MOSFETs), it helps to achieve precise control of electron flow, thereby affecting key performance indicators such as chip speed and power consumption.
Shallow trench insulation: used to fill the shallow trench structure in semiconductor chips, playing a role in insulation and isolation, enabling different regions in the chip to work independently, reducing signal crosstalk, and improving the integration and stability of the chip.
Used for preparing masks and photoresist
Photoresist auxiliary materials: Inorganic polysilazane can be used as an additive or auxiliary material for photoresist to improve its performance, such as increasing the resolution, corrosion resistance, and thermal stability of photoresist, which helps to achieve finer patterning processes in semiconductor manufacturing and produce smaller transistor and circuit structures.
Mask material: After special treatment, it can be used to prepare mask plates. In the photolithography process, the pattern on the mask plate determines the shape and layout of the circuits on the chip. Masks made of inorganic polysilazane have good chemical stability and graphic fidelity, and can accurately transfer design patterns to semiconductor wafers.
As a ceramic precursor for packaging materials
Ceramic packaging shell: Inorganic polysilazane can be converted into high-performance ceramic materials through processes such as pyrolysis, which are used to manufacture packaging shells for semiconductor devices. This ceramic packaging shell has good mechanical properties, high temperature resistance, and chemical stability, which can provide reliable physical protection for semiconductor chips and prevent them from being affected by external environments such as moisture, dust, and mechanical impacts.
Encapsulation coating: It can be used as an encapsulation coating material, applied to the surface of semiconductor chips or packaging structures, to prevent moisture, corrosion, and insulation, improve the long-term stability and reliability of semiconductor devices, and extend their service life.

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