The application prospects of inorganic polysilazane in semiconductor packaging materials are very broad, mainly reflected in the following aspects:
Technological development drives progress
Performance improvement: With the continuous advancement of materials science and technology, the preparation process of inorganic polysilazane will continue to be optimized, and its performance such as higher thermal stability, lower dielectric constant, and better mechanical properties will be continuously improved, enabling it to better meet the requirements of semiconductor packaging in high temperature, high frequency, and high integration.
Adaptation to new technologies: In advanced packaging technologies such as 3D integration and fanout packaging, inorganic polysilazane can be used as insulation layer, sealing layer, etc., which helps to achieve smaller packaging size, higher performance and reliability, and adapts to the trend of semiconductor technology towards miniaturization and high performance.
Market demand growth
Driven by 5G and emerging industries: The rapid development of emerging industries such as 5G communication, artificial intelligence, and the Internet of Things has significantly increased the demand for semiconductor devices, and requires better performance in semiconductor packaging. Inorganic polysilazane, as a high-performance packaging material, can meet the high reliability and heat dissipation requirements of semiconductor devices in these industries, and the market demand will expand accordingly.
In the field of automotive electronics, the development of electrification and intelligence in automobiles has led to increasingly high requirements for semiconductor packaging in automotive electronic systems. The high stability and reliability of inorganic polysilazane can ensure the stable operation of semiconductor devices in complex environments such as temperature, humidity, and vibration in automotive electronics, and has broad application prospects in the field of automotive electronic packaging.
Policy support and assistance
At the national strategic level, many countries and regions have made the semiconductor industry a strategic priority and introduced a series of supportive policies, including support for the research and production of semiconductor packaging materials. Inorganic polysilazane, as a semiconductor packaging material with development potential, is expected to benefit from these policies, accelerate technology research and industrialization processes.
Environmental policy promotion: The strengthening of environmental regulations has prompted the semiconductor packaging industry to seek more environmentally friendly materials. Inorganic polysilazane is relatively environmentally friendly in production and use, meeting the requirements of sustainable development. Under policy promotion, its market application will be further expanded.
Industry development trend
Domestic substitution demand: The international trade situation and global geopolitical changes have led many countries and regions to strengthen their semiconductor localization development strategies, and there is an urgent demand for domestically produced high-performance semiconductor packaging materials. Inorganic polysilazane, as a competitive packaging material, has great potential for development in the process of domestic substitution.
Industry standard establishment: With the increasing application of inorganic polysilazane in the semiconductor packaging field, relevant industry standards and specifications will also be gradually established and improved, which will help regulate the market, promote the widespread application of inorganic polysilazane in semiconductor packaging materials, and promote the healthy development of the industry.

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