Vapor deposition

The vapor deposition method is divided into physical vapor deposition (PVD) and chemical vapor deposition (CVD).

Physical Vapor Deposition (PVD)  

PVD is a technology that uses heating or high-energy beam bombardment in a vacuum chamber to evaporate the material or target to a gaseous state and deposit it on the surface of the workpiece to form a coating.

In recent years, with the continuous development of PVD, various advanced PVD technologies have been derived by combining various technologies, such as reactive magnetron sputtering (RMS), plasma molecular beam epitaxial growth (PA-MBE), pulsed laser deposition (PLD), magnetron pulsed laser deposition (MSPLD), ionized magnetron sputtering, vacuum plasma spraying, and other new technologies for preparing ceramic thin film coatings [8]. Although PVD method started relatively late, it has developed rapidly, with high coating purity, good density, and strong adhesion between the coating and the substrate. Meanwhile, its drawbacks lie in the strict process requirements, high equipment costs, and long coating cycles of the PVD coating method, resulting in a higher cost of PVD coating.

Chemical Vapor Deposition (CVD)     

CVD is a process that utilizes multiple gases to undergo chemical reactions on the surface of heated parts, thereby obtaining the required coating. When using CVD technology to prepare coatings, due to the flow of reactive gases, the coating elements can reach any part of complex parts or cavity parts. Therefore, the biggest feature of this process is its extremely high surface coating rate, and currently there is no process that can replace it.

Compared to PVD technology, CVD technology also has higher production efficiency and lower production costs. However, it should also be pointed out that CVD technology has a high reaction temperature, which can easily lead to weak adhesion between the coating and the substrate or deformation of the substrate. In addition, CVD technology often accompanies the generation of toxic and harmful gases, which, if not handled properly, can cause harm to health and the environment. Therefore, the future development direction of CVD technology in preparing high-performance ceramic coatings is low temperature and environmentally friendly.

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