As a precursor for ceramic packaging materials
Preparation of ceramic shell: Inorganic polysilazane can be converted into high-performance ceramics such as silicon nitride (Si ∝ N ₄), silicon carbide (SiC), etc. through high-temperature pyrolysis. The ceramic shell made of it has high mechanical strength and can withstand external impacts; Has good high temperature resistance and can withstand the high temperature generated by chip operation; Good chemical stability, which can prevent external chemical substances from corroding the chip.
Forming ceramic based composite materials: Combining with reinforcing materials such as carbon fiber and silicon carbide fiber to form ceramic based composite materials for packaging. It can improve the toughness and thermal shock resistance of packaging materials, enabling semiconductor devices to remain stable in environments with drastic temperature changes.
Used for insulation and sealing
Insulation coating: It can form an insulation coating on the surface of semiconductor chips and packaging structures, with excellent dielectric properties. It can achieve electrical isolation between the chip and the external environment, prevent leakage and short circuits, and improve the reliability and stability of the chip. In addition, the coating also has good chemical corrosion resistance and wear resistance, which can protect the chip surface from the effects of chemical substances and mechanical wear.
Sealing material: Utilizing the fluidity and solidification properties of inorganic polysilazane, it can be used as a sealing material to fill the gap between the chip and the packaging shell. The sealing layer formed after curing can effectively block moisture, dust, and other pollutants from entering the interior of the package, avoiding damage to the chip and extending its service life.
Implement heat dissipation and thermal management
Heat dissipation coating: Some inorganic polysilazanes have certain thermal conductivity and can be coated on the surface of chips or packaging shells to help quickly dissipate the heat generated by chips, improve heat dissipation efficiency, prevent chip degradation or damage due to overheating, and ensure the stability of semiconductor devices under high-power and long-term working conditions.
Thermal interface material: As a thermal interface material filled between the chip and the heat sink, it can effectively reduce thermal resistance, facilitate the smooth transfer of heat from the chip to the heat sink, improve the performance of the entire heat dissipation system, and ensure that the chip operates within a suitable temperature range.
Improve the reliability and stability of packaging
Stress buffering: Inorganic polysilazane has a certain degree of flexibility and elasticity after curing, which can buffer the stress generated between the chip and the packaging material due to differences in thermal expansion coefficients during the packaging process and chip operation, reduce the damage caused by stress concentration to the chip, and improve the reliability of the packaging.
Anti radiation protection: In some special application scenarios, such as semiconductor device packaging in aerospace, military and other fields, inorganic polysilazane can provide certain anti radiation performance, protect chips from high-energy particles and radiation damage, and ensure that devices can work normally in harsh radiation environments.

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