Compared with traditional semiconductor packaging materials such as ceramics, epoxy resins, and metals, inorganic polysilazane has the following advantages in semiconductor packaging materials:
Compared to ceramic materials
Better processability: Inorganic polysilazane can be used to prepare ceramic materials through polymer molding methods, such as coating, impregnation, etc., which can more easily achieve packaging of complex shapes and fine structures. Compared with traditional ceramic packaging processes such as high-temperature sintering, the equipment requirements are relatively low and the process window is wider.
Stronger designability: By designing the molecules of polysilazane, ceramic materials with different chemical compositions and structures can be obtained, allowing for more flexible adjustment of material properties to meet the special needs of different semiconductor packaging, while traditional ceramic material composition and performance adjustments are relatively limited.
Compared to organic polymer materials such as epoxy resin
Higher thermal stability: Inorganic polysilazane can be converted into ceramic materials at high temperatures and can withstand higher temperatures. Compared with organic polymers such as epoxy resin, its thermal decomposition temperature is higher. In the case of high temperature generated by high-power operation of semiconductor devices, it can better maintain performance stability and reduce packaging failure caused by thermal aging and other issues.
Better chemical stability: The formed ceramic structure has high chemical stability and can resist more types of chemical substances. In harsh chemical environments, it can better protect chips from damage than organic polymer packaging materials.
Low dielectric constant and low loss: Inorganic polysilazane after ceramicization usually has lower dielectric constant and dielectric loss, which is beneficial for improving the high-frequency performance of semiconductor devices, reducing energy loss and delay during signal transmission, and has advantages in high-frequency and high-speed semiconductor packaging.
Compared to metal materials
Outstanding insulation performance: Metal materials generally have good conductivity, while inorganic polysilazane has excellent insulation performance after curing, which can achieve electrical isolation between chips and the external environment, prevent short circuits and leakage problems, and better meet the insulation requirements of semiconductor packaging.
Adjustable coefficient of thermal expansion: The coefficient of thermal expansion of inorganic polysilazane can be adjusted through molecular design and formulation to be closer to that of chips and other packaging materials. This allows for better buffering of thermal stress during temperature changes, reducing chip damage or packaging failure caused by mismatched thermal expansion, while the coefficient of thermal expansion of metals remains relatively fixed.  

For more details, pls check IOTA PHPS