Organic silicone resin and ceramic materials have their own advantages and disadvantages in high temperature resistance. The following is a specific comparison:
Advantage aspects
Organic silicon resin:
Good flexibility and processability: Organic silicone resin has good flexibility and can adapt to substrate surfaces of different shapes and curves. It can be easily formed into a uniform coating through conventional coating methods such as spraying and brushing. For example, when coating high-temperature resistant coatings on the heat dissipation parts of some electronic components with complex shapes, silicone resin can easily cover them to ensure good adhesion. Meanwhile, its processing technology is relatively simple and does not require complex molding processes such as high-temperature sintering like ceramic materials, resulting in lower costs and operational difficulties.
Strong adhesion to the substrate: Organic silicone resin can form good adhesion with various substrate materials (such as metal, plastic, etc.), firmly adhering to the surface of the substrate without easy detachment. In practical applications, such as coating the outer wall of some outdoor metal pipelines with silicone resin for high-temperature protection, as long as the surface pretreatment is appropriate, it can be tightly adhered to the pipeline for a long time, continuously exerting high-temperature resistance and protective effects.
Good thermal stress buffering ability: Due to its elasticity and flexibility, silicone resin can better buffer thermal stress when temperature changes, reducing the damage caused by internal stress caused by thermal expansion and contraction to itself and the substrate. For example, when used on surfaces of devices that frequently experience temperature fluctuations, compared to ceramic materials, it is less prone to cracking, peeling, and other problems due to thermal stress.
Ceramic materials:
High temperature resistance limit: Ceramic materials such as alumina and zirconia have extremely high melting points, with alumina having a melting point of up to 2072 ℃ and zirconia having a melting point of around 2715 ℃, far higher than the temperature range of 200 ℃ -300 ℃ that organic silicon resins can withstand for a long time. They can remain solid and structurally stable in ultra-high temperature environments, and can be used in applications such as thermal barrier coatings for aircraft engines that require extremely high temperatures.
Strong chemical stability: Ceramic materials have excellent chemical stability in high-temperature environments, and are not easily subjected to chemical reactions with oxygen, other corrosive gases, and common chemicals in the air. They can effectively resist high-temperature oxidation, corrosion, etc., ensuring that their high-temperature resistance is not affected by external chemical factors. For example, ceramic coatings are used on the inner walls of high-temperature reaction vessels in the chemical industry, which can still provide good protection even when facing various high-temperature chemical reaction media.
Excellent hardness and wear resistance: Ceramic materials usually have high hardness, such as silicon carbide ceramics, which are second only to diamond in hardness and also have excellent wear resistance in high temperature environments. In some high-temperature scenarios with friction and wear, such as coating ceramic coatings on the surface of continuous casting crystallizers in the steel metallurgy industry, it can effectively resist the high-temperature erosion and wear of molten steel, and extend the service life of crystallizers.
Shortcomings
Organic silicon resin:
Low high temperature resistance limit: Its long-term use temperature is generally limited to 200 ℃ -300 ℃. Even if some modified products can withstand higher temperatures in the short term, the gap is significant compared to the high temperature resistance of ceramic materials, which can easily reach thousands of degrees Celsius. It cannot meet the requirements in ultra-high temperature environments, such as in high-temperature core components such as aviation engine combustion chambers, where silicone resin is difficult to handle.
Chemical changes are prone to occur at high temperatures: When the temperature approaches or exceeds its tolerance limit, organic silicon resin is prone to chemical changes such as oxidation and decomposition, leading to a decrease in performance. Its original chemical properties such as electrical insulation and corrosion resistance will be greatly reduced, and it can no longer effectively protect the substrate from external factors.
Significant changes in physical properties at high temperatures: As the temperature increases, the hardness, elastic modulus, and other physical properties of silicone resin will undergo significant changes, such as a decrease in hardness and elastic modulus, which weakens its protective and supporting functions at high temperatures. For example, when originally used as a wear-resistant coating layer, the wear resistance effect will be lost at high temperatures due to the decrease in hardness.
Ceramic materials:
Poor flexibility: Ceramic materials are hard and brittle in texture, lacking flexibility. When subjected to external force impact, thermal stress impact, etc., they are prone to cracking or even breakage, and cannot cushion stress through their own deformation like silicone resin, which limits their application scenarios to a certain extent. For example, when used on equipment that requires frequent vibration and thermal shock, the integrity of ceramic coatings is difficult to maintain.
Complex molding process: The preparation of ceramic coatings often requires complex processes such as high-temperature sintering and thermal spraying, which have high equipment and technical requirements and relatively high costs. In addition, defects such as pores and cracks are prone to occur during the molding process, affecting the quality and performance of the coating. Unlike organic silicon resins, which can be easily coated and applied.
Difficulty in bonding with the substrate: The bonding between ceramic materials and substrate materials (especially metal substrates) is relatively difficult, and there is a risk of weak bonding. Special transition layers, pretreatment, and other methods need to be used to enhance adhesion. Otherwise, during high-temperature use, the coating layer is prone to peel off from the substrate, and its high temperature resistance and other performance advantages cannot be fully utilized.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.