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Curing method of organic silicon high-temperature resistant coating

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Condensation reaction solidification
Silicon hydroxyl condensation: Organic silicon resin contains silicon hydroxyl groups (- Si-OH). Under high temperature, condensation reactions occur between silicon hydroxyl groups, and two silicon hydroxyl groups remove one water molecule, forming a silicon oxygen silicon bond (- Si-O-Si -), which connects resin molecules to each other and forms a network structure to achieve curing. Pure silicone coatings and acrylic modified silicone coatings often use this curing method.
Hydrolysis and condensation of alkoxysilane: For organic silicon oligomers containing alkoxysilane, at room temperature or under certain conditions, the alkoxyl group (- OR) will first hydrolyze to form silicon hydroxyl groups, which then undergo condensation reactions to form a silicon oxygen silicon bond network structure, achieving the curing of the coating. Some single component room temperature curing organic silicon high-temperature resistant coatings utilize this principle.
Addition reaction curing: Some components in the organic silicon coating, such as silicone oil containing vinyl groups (- CH=CH ₂), undergo addition reactions with compounds containing silicon hydrogen bonds (- Si-H) under the action of platinum catalysts, causing molecular chains to crosslink with each other and form a cured network structure. This curing method can usually be carried out at room temperature or under heating conditions, and has the advantages of fast curing speed and no by-product generation.
Oxidation reaction curing: Some organic silicon coating materials, such as single component organic silicon release agents, contain a large amount of organic silicon monomers and oxidants. Under high temperature conditions, the oxidants will oxidize the organic silicon monomers, producing a large number of silicon oxygen bonds, thereby curing the coating material. During the curing process, substances such as carbon dioxide and water will also be produced, which will be evaporated and discharged, making the curing process smoother.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.    
High termperature curing polysilazane, pls check IOTA 9108IOTA 9118.   

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