The following are some factors that can affect the performance of polysilazane insulation materials:
Raw material factors
The structure and molecular weight of polysilazane itself: The distribution of silicon nitrogen bonds in the polysilazane molecular chain, the types and quantities of side groups, and other structural characteristics will affect its properties after curing. For example, polysilazane containing more active groups in its molecular chain may form a denser cross-linked structure after curing, which helps to improve its insulation performance; And molecular weight size is also crucial. Low molecular weight polysilazane has good flowability during processing, but the crosslink density formed after curing is relatively low, which may affect the long-term stability of insulation performance. Although high molecular weight polysilazane can provide higher crosslink density, there may be an increase in processing difficulty.
Impurity content: If the raw material contains trace amounts of metal ions, halogens, and other impurities, it will have a negative impact on the electrical properties of polysilazane insulation materials. Metal ions may become conductive carriers under the action of an electric field, increasing the conductivity of the material and reducing its insulation performance; Halogen atoms may trigger chemical reactions under high temperature and other conditions, disrupting the stable structure of materials and leading to a decrease in insulation performance.
Curing process factors
Curing temperature: Temperature plays a crucial role in the curing reaction of polysilazane. If the curing temperature is too low, the cross-linking reaction of polysilazane will not proceed sufficiently, and sufficient chemical bonds cannot be formed between molecular chains, which will result in low cross-linking density of the cured material and suboptimal mechanical strength and insulation performance; If the curing temperature is too high, it may cause excessive cross-linking of the material, generate internal stress, make the material brittle, and even lead to abnormal conditions such as decomposition, which can also damage its insulation performance.
Curing time: When the curing time is insufficient, the polysilazane cannot complete sufficient curing reaction, and some unreacted active groups will remain, which not only affects the stability of the material, but also greatly reduces the insulation performance, such as possible problems such as increased dielectric constant and decreased resistance; However, if the curing time is too long, in addition to increasing production costs and cycles, it may also lead to a decrease in material properties due to excessive cross-linking, such as reduced toughness and susceptibility to cracking, which in turn affects its actual use as an insulation material.
Types and dosages of curing agents: Different curing agents react with polysilazane through different mechanisms and activities, and their selection will affect the properties of the cured material. For example, some curing agents can promote the formation of more stable and dense cross-linked structures, which helps to improve insulation performance; If the dosage of curing agent is not appropriate, insufficient dosage will cause incomplete cross-linking reaction, and excessive dosage may cause side reactions or uneven internal structure of the material, all of which will have a negative effect on the insulation performance.
environmental factor
Temperature: During use, ambient temperature is an important factor affecting the performance of polysilazane insulation materials. In high temperature environments, the molecular chains of materials may experience intensified thermal motion, chemical bond breakage, and other conditions, leading to a decrease in insulation performance, such as an increase in dielectric constant and a decrease in resistance; Low temperature environments may cause materials to become brittle, reduce flexibility, and be prone to cracking, damage, and other issues when subjected to external forces, which can damage the integrity of the insulation structure and ultimately affect the insulation effect.
Humidity: Humidity has a significant impact on the performance of polysilazane insulation materials. In high humidity environments, moisture is prone to penetrate into the interior of materials. On the one hand, it may react with certain active groups in the material, changing its chemical structure. On the other hand, it can increase the conductivity of the material, reduce insulation resistance, and cause leakage or even short circuits, seriously affecting its normal use as an insulation material.
Chemical contact: When polysilazane insulation materials come into contact with acidic or alkaline solutions, organic solvents, corrosive gases, and other chemical substances, these substances may undergo chemical reactions with the materials, corrode, dissolve, or damage the structure of the materials, resulting in a deterioration of insulation performance. For example, acidic solutions may break key chemical bonds such as silicon nitrogen bonds in materials, causing them to lose their original insulation properties.
Processing technology factors
Uniformity of mixing: In the preparation of polysilazane insulation materials, if the components (such as polysilazane, curing agent, filler, etc.) are not mixed evenly, it will lead to uneven internal structure of the material. Some areas are fully cured, while others are not completely cured, resulting in inconsistent overall insulation performance of the material, weak local performance points, and easy insulation failure during use.
Molding process: Different molding processes, such as coating, injection molding, pressing, etc., can affect the density, surface flatness, and internal stress distribution of materials. For example, improper coating process operation may lead to uneven coating thickness, insufficient insulation performance in thin areas, and cracking, peeling, and other problems in thick areas; If the mold design is not reasonable or the injection parameters are not appropriate in the injection molding process, it may cause defects such as pores and cracks inside the formed material, reducing the insulation performance.
Packing factor
Types of fillers: Adding fillers is to improve the performance of polysilazane insulation materials, but the effects of different types of fillers vary. For example, adding inorganic insulating fillers (such as alumina, silica, etc.) can improve the thermal stability, mechanical strength, and insulation performance of materials, as these fillers themselves have good insulation properties and high temperature resistance; If fillers with certain conductivity are added (such as certain metal powders, even if the content is very low), the insulation performance of the material will be significantly reduced.
Filler content: The filler content needs to be reasonably controlled. When the content is too low, the improvement effect on material properties is not significant; When the content is too high, it may affect the curing reaction of polysilazane, making it difficult for the material to be uniformly dispersed, resulting in agglomeration and deteriorating the processing performance of the material. At the same time, it may also damage the original structure of the material, thereby affecting its insulation performance.
Particle size and dispersibility of fillers: The particle size of fillers affects their dispersibility in polysilazane and their interaction with polysilazane. Small particle size fillers can better fill the gaps inside the material, increase the density of the material, and help improve insulation performance. However, a particle size that is too small may exacerbate agglomeration problems; Good dispersibility can ensure that the filler is evenly distributed in the material, making the material properties uniform and stable. If the dispersibility is not good, there will be significant differences in local properties, which will affect the overall insulation effect.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.     
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.