In the field of semiconductor chips, there are various strict requirements for high-temperature resistant coatings:
High heat resistance: The chip generates a large amount of heat during operation, and the coating needs to withstand temperatures of several hundred degrees or even higher without melting, decomposition, or performance degradation. For example, in high-performance computing chips, due to the fast computing speed and high heat generation of the chip, the coating should be able to stably withstand high temperatures of 200 ℃ -300 ℃ to ensure the normal operation of the chip in high temperature environments and avoid chip damage caused by coating failure.
Good thermal stability: Under frequent temperature changes, the thermal expansion coefficient of the coating should match the chip material (such as silicon) as much as possible to prevent cracking and peeling of the coating due to thermal stress caused by differences in thermal expansion and contraction. Like automotive electronic chips, the temperature fluctuations in the engine compartment during vehicle operation are severe. The good matching of the thermal expansion coefficient between the coating and the chip substrate can ensure the integrity of the coating during long-term thermal cycling and maintain effective protection for the chip.
High chemical stability: There are multiple chemical substances present in the chip manufacturing and usage environment, and the coating cannot undergo chemical reactions with these substances to avoid affecting chip performance. For example, in the photolithography, etching and other process steps of chip manufacturing, various chemical reagents are in contact, and the coating needs to withstand the erosion of these reagents, not be corroded or dissolved, to ensure the smooth progress of the chip manufacturing process and not be damaged by surrounding chemical substances in subsequent use.
Excellent electrical insulation: Semiconductor chips require extremely high electrical performance, and coatings must have good electrical insulation properties to prevent current leakage, short circuits, and other issues from affecting the normal operation of the chip. In integrated circuit chips, the high electrical insulation of coatings can effectively isolate different circuit areas, ensure accurate transmission of electronic signals, and avoid signal interference and electrical faults.
Ultra precise thickness and uniformity: The chip size is small and highly integrated, and the coating thickness needs to be precisely controlled in the ultra-thin range (such as tens of nanometers to a few micrometers), while ensuring uniform coverage of the chip surface. This is because excessive coating may affect chip heat dissipation or cause chip size to exceed tolerances, while uneven coating may result in insufficient local protection or abnormal electrical performance. Taking advanced process chips as an example, the coating thickness deviation needs to be controlled within a very small range to ensure the consistency and stability of chip performance.
High adhesion: Firmly adhering to the surface of the chip is the basis for the coating to function. Under external forces such as vibration and impact during chip manufacturing and use, the coating cannot peel off. For example, in mobile phone chips that may be subject to vibration and collision during daily use, high adhesion coatings can always tightly adhere to the chip, providing continuous protection against high temperatures and other protective functions.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.       
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.