1、 With the continuous development of semiconductor technology, the performance requirements for semiconductor packaging materials are becoming increasingly stringent. Polysilazane, as a new type of organic silicon compound, has shown unique application potential in the semiconductor packaging process and plays an important role in improving the stability and reliability of semiconductor devices. This article will conduct an in-depth analysis of its applications and advantages.
2、 Characteristics of Polysilazane
Polysilazane has excellent high temperature resistance, can maintain good chemical stability in high temperature environments, and is not easily decomposed or denatured. Its molecular structure endows it with good flexibility, which can effectively buffer the stress generated between semiconductor chips and packaging materials due to differences in thermal expansion coefficients. At the same time, it also has excellent film-forming properties and can form a uniform and dense protective film on the surface of semiconductors.
3、 Specific applications in semiconductor packaging
As a passivation layer material
On the surface of semiconductor chips, polysilazane can form a passivation layer through coating and other processes to isolate the invasion of external impurities such as water vapor and oxygen, prevent the corrosion of metal lines on the chip surface, and extend the service life of the chip. For example, in some integrated circuit chips, the use of a polysilazane passivation layer has significantly improved the reliability testing indicators of the chip in humid environments.
Used for chip bonding
Polysilazane can be formulated as a suitable adhesive, and its good bonding performance can ensure a strong bond between the chip and the substrate. It can also maintain the stability of the bond under complex working conditions such as temperature changes, avoiding problems such as chip loosening and detachment, and ensuring the normal operation of semiconductor devices.
4、 Advantage analysis
Performance advantages compared to traditional materials
Compared to traditional packaging materials such as epoxy resin, polysilazane has more outstanding high-temperature and chemical corrosion resistance. In high-temperature aging tests, semiconductor devices encapsulated in polysilazane can maintain better electrical performance and appearance integrity, effectively reducing the risk of failure caused by material aging.
Process adaptability advantage
Polysilazane can be coated and formed using various processes, such as spin coating, spray coating, etc. It is easy to operate and control parameters such as film thickness, and can adapt well to the efficient and high-precision process requirements of large-scale semiconductor production, helping to reduce production costs and improve production efficiency.
5、 Conclusion
Polysilazane has broad application prospects in the field of semiconductor packaging. With its unique performance advantages and good process adaptability, it is expected to further improve the quality of semiconductor packaging in the future and promote the development of the semiconductor industry towards higher performance and reliability. However, further optimization research is needed in terms of cost control and compatibility with other materials.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.       
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.