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In semiconductor integrated circuits, the performance and reliability of interconnect structures play a crucial role in achieving the functionality of the entire chip. Polysilazane, as an emerging material, has gradually attracted attention in the field of integrated circuit interconnects. This article will focus on analyzing its application situation and its impact on interconnect reliability.
2、 Compatibility of relevant characteristics of polysilazane
Polysilazane has the characteristic of low dielectric constant, which is of great significance for reducing signal transmission delay and signal crosstalk in integrated circuit interconnects, and can meet the performance requirements of modern high-speed and high-frequency integrated circuits. Meanwhile, its excellent chemical and thermal stability ensures that it can resist various chemical corrosion and high-temperature environments during the interconnect manufacturing process and subsequent chip operation, maintaining the integrity of the interconnect structure.
3、 Application scenarios in integrated circuit interconnection
As an interconnect medium material
In multi-layer interconnect structures, polysilazane can be used as an insulating medium to fill between metal interconnect lines, replacing traditional high dielectric constant materials, effectively reducing interconnect capacitance and improving signal transmission speed. For example, in some advanced microprocessor chips, using polysilazane as the interconnect medium reduces signal transmission delay by about 20%, significantly improving the chip's computing speed.
Used for interconnect surface protection
Polysilazane can be coated on the surface of interconnect metals to form a protective film, preventing the metal from oxidation and corrosion, especially in harsh working environments such as high humidity and corrosive gases, ensuring the conductivity of interconnect lines and maintaining the stability of signal transmission inside the chip.
4、 Reliability analysis
In terms of long-term stability
The chemical and thermal stability of polysilazane ensures that the interconnect structure will not deteriorate due to material aging, decomposition, and other issues during the long-term operation of the chip. Its low dielectric constant characteristics can also continue to function, ensuring the long-term stability of signal transmission and reducing the probability of chip failure caused by interconnect failure.
Ability to resist environmental interference
Faced with external environmental factors such as water vapor and chemicals, the protective film of polysilazane and the overall stability as a medium enable the interconnect structure to have strong anti-interference ability. Whether in normal use environments or some special industrial environments, it can reliably achieve signal interconnection inside the chip, improving the applicability and reliability of integrated circuits.
5、 Conclusion
The application of polysilazane in semiconductor integrated circuit interconnects has had a positive impact on improving chip performance and reliability. With the continuous development of related technologies, further optimization of its preparation process and cost reduction will help it to be more widely used in the field of integrated circuits and promote the continuous progress of the semiconductor industry.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.       
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.