Polysilazane has broad application prospects in the field of electronic packaging, mainly reflected in the following aspects:
Meet high-performance requirements
High frequency and high speed: With the development of technologies such as 5G communication and artificial intelligence, electronic devices are moving towards high frequency and high speed, requiring higher dielectric performance of electronic packaging materials. Polysilazane has the characteristics of low dielectric constant and low dielectric loss. Using polysilazane as a packaging material can reduce losses and delays during signal transmission, ensure fast and accurate transmission of high-frequency signals, and meet the needs of 5G base stations, high-speed servers, and other equipment.
Miniaturization and Integration: Electronic devices are constantly developing towards miniaturization and integration, with increasing chip integration and smaller packaging space. This requires packaging materials to have good filling performance and reliability. Polysilazane can form a uniform and dense packaging layer in complex chip structures and small gaps through solution processing or chemical vapor deposition techniques, effectively protecting chips from external environmental influences and improving the reliability and stability of packaging.
Aligning with the development of emerging technologies
Power electronic devices: The demand for power electronic devices is increasing in fields such as new energy vehicles and smart grids. These devices generate a large amount of heat during operation and require good heat dissipation and insulation performance. Polysilazane has excellent electrical insulation properties and certain thermal conductivity, which can achieve good insulation and heat dissipation in the packaging of power electronic devices, improve device efficiency and service life, and help promote the development of industries such as new energy vehicles.
Flexible electronics: Flexible electronics technology is an important development direction in the future electronics field, such as flexible display screens, wearable devices, etc. Polysilazane has certain flexibility and processability, which can adapt to the deformation requirements of flexible electronic devices such as bending and stretching. It can be used as a packaging material to provide protection for flexible electronic devices without affecting their flexibility performance, providing support for the large-scale application of flexible electronic technology.
Enhance reliability and stability
Environmental adaptability: Electronic devices may face various complex working environments such as high temperature, high humidity, and chemical corrosion. Polysilazane has excellent thermal stability, chemical stability, and moisture resistance, and can maintain stable performance in harsh environments. It can effectively prevent electronic devices from being corroded by water vapor, chemicals, etc., improve the reliability and service life of electronic devices in different environments, and is suitable for electronic device packaging in special fields such as aerospace and military.
Radiation resistance: In some special application scenarios, such as space exploration, nuclear industry, etc., electronic devices need to have good radiation resistance performance. Polysilazane has a certain degree of radiation resistance, which can protect the performance of electronic devices from being affected in radiation environments and provide reliable packaging guarantees for electronic devices in related fields.
In line with industry development trends
Green environmental protection: With the increasing awareness of environmental protection, the electronic packaging industry is also developing towards green environmental protection. Polysilazane is relatively environmentally friendly in production and use, halogen-free, low toxicity, and meets environmental requirements. Compared with some traditional packaging materials, it is more favored by the market and helps promote the sustainable development of the electronic packaging industry.
Cost reduction potential: Currently, the production cost of polysilazane is relatively high, which limits its large-scale application. However, with the continuous advancement of preparation technology and the expansion of production scale, its production cost is expected to gradually decrease. Once the cost is effectively controlled, the application of polysilazane in the field of electronic packaging will become more widespread, and its market competitiveness will be further enhanced.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.       
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.