The applications of polysilazane in semiconductors mainly include the following aspects:
As a component of photoresist: In the photolithography process, polysilazane can be used as a component of photoresist. It has good chemical stability and adaptability to photolithography processes, which can help photoresist more accurately replicate tiny circuit patterns, improve photolithography resolution, and meet the requirements for fine patterning in semiconductor manufacturing.
Preparation of insulation layer: Polysilazane can form a uniform and dense thin film on the surface of the chip, which can be used as an insulation layer material. This insulation film can effectively isolate the influence of the external environment on the internal circuits of the chip, prevent leakage and interference between circuits, and improve the performance and reliability of the chip. For example, fully hydrogenated polysilazane (PHPS) is commonly used in the preparation of insulation layers in semiconductor manufacturing.
Preparation of passivation layer: During the use of semiconductor devices, their surfaces are easily affected by external factors such as moisture, impurities, etc., which can lead to performance degradation. Polysilazane can be used to prepare passivation layers that cover the surface of chips, providing protection and improving the stability and service life of devices.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.            
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.