Organopolysilazane (OPSZ) and Inorganic Polysilazane differ mainly in three aspects: chemical structure, performance characteristics, and application fields.

Chemical Structure
Organopolysilazane: Its molecular chain contains organic groups (such as alkyl, aryl groups, etc.) alternating with silicon and nitrogen atoms, with a chemical formula typically expressed as [R-Si-N]n (where R represents organic groups). The introduction of organic groups endows it with flexibility and solubility, facilitating processing and modification.
Inorganic Polysilazane: Its molecular chain consists solely of silicon (Si) and nitrogen (N) atoms alternating with each other, without any organic groups, and its chemical formula is [Si-N]n. Its structure is closer to that of inorganic ceramic precursors, possessing higher thermal stability and chemical inertness.

Performance Characteristics
Organopolysilazane:
Flexibility: The presence of organic groups grants it good flexibility and ductility.
Solubility: It is soluble in organic solvents, making it convenient for coating and molding.
Curing Temperature: It generally requires a relatively low curing temperature (e.g., 200-400°C), and upon curing, it forms an organic-inorganic hybrid material.
Performance: The cured material combines the flexibility of organic substances with the heat resistance and corrosion resistance of inorganic substances.
Inorganic Polysilazane:
High Hardness: After curing, it forms high-hardness inorganic ceramic materials (such as Si₃N₄).
High-Temperature Resistance: It exhibits excellent thermal stability and can withstand temperatures above 1000°C.
Chemical Inertness: It demonstrates strong corrosion resistance to acids, bases, and other chemical substances.
Curing Temperature: It requires a relatively high curing temperature (e.g., 800-1200°C), and upon curing, it forms a purely inorganic material.

Application Fields
Organopolysilazane:
Coating Materials: Used for high-temperature and corrosion-resistant coatings, such as in aerospace and automotive engine component protective coatings.
Composite Materials: Acts as a modifier for resin matrices, improving the mechanical properties and heat resistance of composite materials.
Electronic Materials: Used for semiconductor packaging, insulation and protective layers of electronic devices.
Inorganic Polysilazane:
Ceramic Precursors: Used for preparing high-performance ceramic materials, such as silicon nitride and silicon carbide ceramics.
High-Temperature Structural Materials: Used for manufacturing high-temperature furnace components, gas turbine parts, etc.
Corrosion-Resistant Materials: Used in chemical equipment, pipelines, and other corrosion-resistant scenarios.

Summary
Organopolysilazane: Emphasizes flexibility, solubility, and relatively low curing temperatures, making it suitable for coatings, composite materials, and electronic materials.
Inorganic Polysilazane: Emphasizes high hardness, high-temperature resistance, and chemical inertness, making it suitable for ceramic precursors and high-temperature structural materials.
The differences in chemical structure and performance between these two materials determine their respective advantages and applicability in different application fields.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K .  
High termperature curing polysilazane, pls checkIOTA 9108, IOTA 9118 .
Inorganic Polysilazanes，pls check IOTA-PHPS .