Hardness and wear resistance: During the thermal curing process, resin molecules are fully cross-linked to form a tight three-dimensional network structure, which significantly increases the hardness of the coating. For example, after heat curing, the hardness of epoxy resin coatings can reach a high level, making them less prone to scratches and wear when subjected to external friction and scratching. Therefore, their wear resistance is also correspondingly enhanced, and they are commonly used in industrial equipment surfaces, floors, and other scenarios that require wear protection.
Chemical resistance: Good thermal curing can enhance the chemical stability of the coating and increase its resistance to chemicals such as acids, alkalis, and organic solvents. Because the cross-linked structure can effectively block the invasion of external chemical substances and reduce the possibility of chemical reactions with resin molecules, such as the phenolic resin coating after thermal curing, it can maintain good stability in acidic and alkaline environments and is suitable for protection of parts with chemical corrosion risks such as chemical pipelines.
Adhesion: Appropriate heat curing conditions can help enhance the adhesion between the coating and the substrate. During the heating process, the resin coating will interact and infiltrate better with the substrate surface, forming a strong bonding interface. However, if the curing temperature is too high or the curing time is too long, it may cause excessive internal stress in the coating, which in turn affects adhesion. Therefore, precise control of curing parameters is necessary.
Flexibility: Generally speaking, when the degree of heat curing is high, the cross-linking density of the coating increases, and the flexibility will decrease. However, by selecting resin raw materials reasonably and adding appropriate plasticizers, the flexibility of the coating can be adjusted while ensuring a certain hardness and curing effect, so that it can adapt to the usage needs of different substrates under deformation, bending, and other conditions.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.