Application scenarios:
Chip packaging: a packaging material used for high-power electronic components.
Sensor protection: a protective coating used for high-temperature sensors.
Advantages:
High temperature resistance: suitable for packaging high-power electronic components, providing good thermal stability.
Insulation: Excellent electrical insulation performance, protecting electronic components from short circuits and breakdowns.
Mechanical protection: Provides mechanical strength and wear resistance to protect fragile electronic components.
Actual case:
Power module packaging: Polysilazane is used for packaging IGBT (Insulated Gate Bipolar Transistor) modules, which improves the reliability and lifespan of the modules.
High temperature sensor coating: used for the protection of automotive and industrial high-temperature sensors, ensuring stable operation of sensors in extreme environments.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.