Physical vapor deposition method
Vacuum system preparation: Place the substrate to be coated into the vacuum coating equipment and evacuate it to the required vacuum degree to ensure that the deposition process is carried out in a low-pressure environment.
Preparation of evaporation source: Select suitable high-temperature resistant materials as evaporation sources, such as metals (such as tungsten, molybdenum, etc.), ceramics (such as boron nitride, silicon carbide, etc.).
Deposition process: The evaporation source material is evaporated or sputtered into gaseous atoms or ions through methods such as resistance heating, electron beam heating, or ion beam sputtering. These gaseous particles fly towards the substrate surface in a vacuum environment and deposit on the substrate surface to form a high-temperature resistant coating.
Process control: During the deposition process, it is necessary to precisely control parameters such as temperature, power, vacuum degree, and deposition time of the evaporation source to control the thickness, composition, and performance of the coating.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.