In the field of semiconductor materials, polysilazane has various applications, as follows:Applications related to photoresist
As the main material of photoresist: photoresist is an extremely critical material in semiconductor manufacturing processes, used to transfer circuit patterns from masks to substrates such as silicon wafers. After special chemical modification, polysilazane can have suitable properties such as sensitivity, resolution, and good adhesion to substrates, making it the main component of photoresist. During the photolithography process, it exhibits different chemical properties such as solubility in the exposed and unexposed areas, allowing for precise formation of desired circuit patterns on the substrate through subsequent steps such as development. This helps to achieve high-precision micro/nano structure processing in chip manufacturing, such as in advanced process chip manufacturing where high line precision is required. Polysilazane photoresist can play an important role.
Improving the performance of photoresist: It can be blended with some components of traditional photoresist, such as resin, photosensitizer, etc., to optimize the overall performance of photoresist based on its good thermal stability, chemical stability, and compatibility with other materials. For example, adding polysilazane can enhance the stability of photoresist in subsequent processes such as high-temperature baking, avoid deformation and decomposition caused by heat, ensure the accuracy and quality of photoresist patterns, and improve the adhesion ability of photoresist to different substrate materials, reducing the occurrence of adverse phenomena such as photoresist detachment during processing.
Application in semiconductor packaging field
Components of packaging materials: In semiconductor chip packaging, multiple materials are required to protect the chip and achieve electrical connections between the chip and external circuits. Polysilazane can be used as a component of packaging materials, for example, it can be mixed with commonly used packaging materials such as epoxy resin to improve the overall performance of the packaging material by utilizing its flexibility, moisture resistance, and good filling properties. During long-term use, it can better resist the invasion of external water vapor, impurities, etc., prevent the chip from getting damp, corroded, etc., and extend the service life of the chip.
Bottom filling material: For some packaging forms such as flip chip, it is necessary to fill the material between the chip and the substrate to buffer stress, enhance mechanical connection, and improve electrical performance. Polysilazane can be used as a bottom filling material by adjusting the appropriate formula. It can effectively fill the small gaps between the chip and the substrate, and form a structure with certain elasticity and strength after curing. It effectively disperses the thermal and mechanical stresses generated by the chip during operation, avoids damage to the chip due to stress concentration, and ensures the normal operation of the chip.
Insulation and passivation applications in semiconductor manufacturing
Insulation material: Within semiconductor devices, good insulation materials are required between different circuit components and conductive layers to prevent electrical faults such as short circuits. After curing, polysilazane has excellent electrical insulation properties and can be used to form insulation layers in chip manufacturing processes. For example, in multi-layer wiring structures, insulating layers made of polysilazane can be coated between different metal wiring layers to ensure electrical isolation between each layer and provide guarantees for the stable operation of semiconductor devices.
Passivation material: In order to protect the active areas, metal interconnects, and other structures on the surface of semiconductor chips from external environmental factors such as oxygen, water vapor, and impurity ions, passivation treatment is required. Polysilazane can be used as an effective passivation material to form a dense and stable protective film on the surface of the chip, suppress the influence of external environmental factors on the internal structure of the chip, improve the reliability and stability of the chip, and reduce performance degradation caused by environmental factors.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.     
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.