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Photolithography is one of the core processes in semiconductor manufacturing, which is related to the process accuracy and performance of chips. Polysilazane, as a functional material, is gradually emerging in the field of semiconductor lithography, playing a positive role in the improvement and optimization of lithography processes. This article will analyze in detail its application situation and the impact it brings.
2、 Related characteristics of polysilazane
Polysilazane has good solubility and can be uniformly dispersed in organic solvents commonly used in photolithography, making it easy to prepare solutions such as photoresist. The silicon nitrogen bond in its molecular structure endows it with unique optical and chemical properties, such as suitable absorption and refraction characteristics for specific wavelengths of light, which helps to precisely control the photochemical reactions in the photolithography process. At the same time, it also has a certain degree of etching resistance, which can protect the semiconductor material below in the subsequent etching process.
3、 Application methods in photolithography process
As a photoresist material
Through reasonable formula design, polysilazane can be used to produce positive or negative photoresist. During the exposure process, its photochemical reaction can accurately achieve pattern transfer and form high-precision circuit patterns. For example, in some advanced process chip manufacturing, polysilazane photoresist can achieve pattern production with smaller line widths, meeting the development needs of semiconductor chips constantly shrinking in size.
As an anti reflective coating material
During lithography, polysilazane can be coated on the surface of semiconductor substrates to form an anti reflective coating, reducing the impact of reflected light on lithography accuracy, improving exposure resolution, making lithography patterns clearer and more accurate, reducing lithography defects caused by reflection, and improving the yield of chip manufacturing.
4、 Analysis of the Impact on Photolithography Process
Improving process accuracy
The use of polysilazane photoresist and anti reflective coatings can effectively break through the limitations of traditional photolithography materials in terms of resolution, enabling chips to achieve finer circuit structure manufacturing and driving semiconductor chips towards higher processes, such as the transition from 14 nanometers to 7 nanometers or even smaller processes, where their role becomes increasingly prominent.
Process stability impact
The chemical stability of polysilazane ensures that its performance remains relatively stable during the photolithography process, whether it is exposure, development, or etching, reducing process errors caused by material performance fluctuations, improving the stability and repeatability of the entire photolithography process, and facilitating large-scale stable semiconductor production.
5、 Conclusion
The application of polysilazane in semiconductor lithography technology has brought new opportunities to improve chip manufacturing accuracy and process stability. However, its cost control in large-scale production and compatibility with existing lithography equipment still need continuous attention. With the deepening of related research, it is expected to better assist the development of semiconductor lithography technology.

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High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.