1、 Introduction
Semiconductor devices generate a large amount of heat during operation, and if they cannot effectively dissipate heat, it will seriously affect their performance and service life. Polysilazane has gradually become a research hotspot in semiconductor heat management due to its special thermal and physicochemical properties. This article aims to analyze its specific applications and heat dissipation efficiency in this field.
2、 Thermal and Related Properties of Polysilazane
Polysilazane has a certain thermal conductivity, although it cannot compare to some specialized high thermal conductivity metal materials, it performs more outstandingly in organic materials. At the same time, it also has good filling and plasticity, which can be well adhered to various shapes and surfaces in semiconductor heat dissipation structures. Its thermal conductivity can be further improved by adding thermal conductive fillers and other methods. It also has good insulation properties, avoiding risks such as circuit short circuits caused by the conductivity of heat dissipation materials.
3、 Application forms in semiconductor heat dissipation management
As a material for heat dissipation interface
Polysilazane can be used as a heat dissipation interface material to fill the gap between the semiconductor chip and the heat sink, effectively reducing the contact thermal resistance and allowing heat to be transferred more smoothly from the chip to the heat sink. For example, in some high-power integrated circuit modules, the use of polysilazane heat dissipation interface materials can reduce the operating temperature of the chip by about 10-20 ℃, significantly improving the heat dissipation efficiency.
Used for the preparation of heat dissipation coatings
Mixing polysilazane with thermal conductive fillers to form a heat dissipation coating, which can be applied to semiconductor packaging shells and other parts to increase the heat dissipation surface area. It can dissipate heat to the surrounding environment through thermal radiation and other methods, especially suitable for semiconductor application scenarios with limited space and difficulty in installing large heat dissipation devices.
4、 Analysis of heat dissipation efficiency
Compare the efficiency of traditional heat dissipation materials
Compared to traditional heat dissipation interface materials such as silicone grease, polysilazane is less prone to drying up and aging during long-term use, and can maintain good thermal conductivity, ensuring the continuity and stability of heat dissipation. In terms of heat dissipation coatings, compared with ordinary organic coatings, the addition of thermal conductive fillers has significantly improved the heat dissipation ability, which can better meet the heat dissipation needs of semiconductor devices.
Comprehensive evaluation of heat dissipation effect
From the perspective of the entire semiconductor heat dissipation system, the application of polysilazane can optimize the heat transfer path, improve heat dissipation efficiency, reduce the risk of performance degradation and failure caused by chip overheating, and extend the reliable operation time of semiconductor devices. It is of great significance for improving the overall quality and stability of semiconductor products.
5、 Conclusion
The application of polysilazane in semiconductor heat dissipation management has demonstrated excellent heat dissipation efficiency and application advantages. With further research on improving its thermal conductivity and reasonable cost control, it is expected to play a more critical role in the future semiconductor heat dissipation field, ensuring the efficient and stable development of the semiconductor industry.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K.       
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.