There are many differences between silicone resin and epoxy resin, as follows:
Chemical Structure
Silicone resin: The main chain is composed of Si-O-Si bonds, and different organic groups such as methyl, ethyl, phenyl, etc. are connected to the silicon atoms.
Epoxy resin: It contains two or more epoxy groups in its molecule and is a condensation product of epichlorohydrin with bisphenol A or polyols.
Performance characteristics
Heat resistance: Silicone resin has better heat resistance and can generally be used for a long time at temperatures of 200 ℃ -300 ℃ or even higher. Some special formulations can withstand higher temperatures; Epoxy resin is generally used for a long time at temperatures around 150 ℃, and the temperature resistance range of ordinary epoxy resin is usually between -20 ℃ and 80 ℃.
Electrical insulation: Silicone resin can still maintain good dielectric properties at high frequencies; Epoxy resin also has good electrical insulation performance, but it is slightly inferior to silicone resin under high frequency and other conditions.
Flexibility and hardness: Silicone resin has stronger flexibility; Epoxy resin has high hardness after curing.
Weather resistance: Silicone resin has strong resistance to environmental factors such as ultraviolet radiation, ozone, and humidity, and is not easily aged or discolored outdoors for a long time; Epoxy resin has relatively poor weather resistance and is prone to powdering and loss of gloss when used outdoors for a long time.
Chemical resistance: Silicone resin is stable to most chemicals such as acids, bases, salts, solvents, etc; Epoxy resin has excellent chemical resistance, especially alkali resistance.
Curing characteristics
Silicone resin: usually requires high temperature curing, with a relatively long curing time, and some can also be cured at room temperature.
Epoxy resin: It can be quickly cured at room temperature or lower temperature by adding a curing agent, and the curing time can be precisely controlled by adjusting the type and amount of curing agent. Generally, it has a two-component form, and the resin and curing agent need to be mixed in a certain proportion.
application area 
Silicone resin: suitable for high-temperature environments, such as coatings and insulation materials for high-temperature equipment; Used in the field of electronic appliances for components with extremely high insulation performance requirements; Also used for outdoor building coatings, waterproof materials, etc. that require high weather resistance; It is also used as a release agent, isolation coating, etc.
Epoxy resin: widely used in adhesives, known as the "universal adhesive", used for bonding various materials such as metal, glass, wood, etc; Used in the field of coatings for anti-corrosion paints, metal primers, etc; Used for insulation packaging of electronic components in electronic appliances; It is also an important substrate for manufacturing high-performance composite materials, used in aerospace, automotive manufacturing, etc.
Appearance and physical form
Silicone resin: generally a colorless, transparent or slightly yellow liquid or solid with low surface tension, smooth surface after curing, and good hydrophobicity.
Epoxy resin: can be liquid or solid, with colors ranging from transparent to yellow, and a density of approximately 1.2g/cm ³.
cost
Silicone resin: The synthesis process is usually relatively complex, the raw material cost is high, and the product price is also relatively high.
Epoxy resin: With mature production technology, extensive raw material sources, and relatively low costs, it has cost advantages in large-scale applications.

Room termperature curing polysilazane, pls check IOTA 9150, IOTA 9150K. 
High termperature curing polysilazane, pls check IOTA 9108, IOTA 9118.